Laser, Vision, Intelligence ±â¼úÀº ÀÚµ¿Â÷, ¹ÝµµÃ¼, µð½ºÇ÷¹ÀÌ, ÀÇÇÐ, ±âÃʰúÇÐ µî ¸ðµç »ê¾÷ºÐ¾ßÀÇ »ç¿ëµÉ ¼ö ÀÖ´Â ÀÚµ¿È­ ±â°èÀåºñ, ·¹ÀÌÀú °¡°øÀåºñ, ·¹ÀÌÀú ÀÇ·áÀåºñ, ºñÀü°Ë»ç °èÃøÀåºñ µî¿¡ ´Ù¾çÇÏ°Ô ÀÀ¿ëµÇ°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ, ¿ä¼Ò±â¼ú¿¡ °ü·ÃµÇ´Â Àåºñ/ºÎǰÀ» ÇÊ¿ä·Î ÇÏ´Â °í°´¿¡°Ô ¸¸Á·ÇÒ ¼ö ÀÖ´Â ÅëÇÕ ±â¼ú Á¦°ø ¹× »õ·Î¿î ÀÀ¿ë±â¼ú °³¹ßÀ» ÇÒ ¼ö ÀÖµµ·Ï ÃÖ¼±ÀÇ Çù·ÂÀ» ´ÙÇϰí ÀÖ½À´Ï´Ù.
 
 
·¹ÀÌÀú ´ÙÀÌ¿Àµå (Laser Diode), ·¹ÀÌÀú ´ÙÀÌ¿Àµå ¾î·¹ÀÌ (Laser Diode Array)
  ·¹ÀÌÀú ´ÙÀÌ¿Àµå ½ºÅØ(Laser Diode Stack), ·¹ÀÌÀú ÆßÇÁ ¸ðµâ (Laser Pump Module)
»ê¾÷¿ë, R&D¿ë, ÀÇ·á¿ë ·¹ÀÌÀú ½Ã½ºÅÛ
·¹ÀÌÀú ´ÙÀÌ¿Àµå µå¶óÀ̹ö (Laser Diode Driver)
»ê¾÷ÀÀ¿ëºÐ¾ß : ·¹ÀÌÀú ¸¶Å· (Laser Marking), ·¹ÀÌÀú ÄÆÆÃ (Laser Cutting)
    ·¹ÀÌÀú ¿ëÁ¢ (Laser Welding), ·¹ÀÌÀú ¿­Ã³¸® (Laser Heat Treatment)
  ÀÇ·á¿ë ÀÀ¿ëºÐ¾ß : ¿Ü°ú¼ö¼ú / Ä¡°ú¿ë·¹ÀÌÀú, ÇǺΰú (Skin Care) ·¹ÀÌÀú,
    ºñ´¢±â°ú ·¹ÀÌÀú (Prostate Laser)
  R&D¿ë ÀÀ¿ëºÐ¾ß : Ins OPO ·¹ÀÌÀú, Short Pulse ´ÙÀÌ¿Àµå ·¹ÀÌÀú, ·¹ÀÌÀú PIV ½Ã½ºÅÛ
    (Laser Particle Image Velocity System)
 
 
     
EUV, VUV, UV, NIR Ä«¸Þ¶ó (Camera)
  ·¹ÀÌÀú ºö °èÃø¼¾¼­ (Measurment Sensor)
  ·¹ÀÌÀú ºö ½ºÄµÇìµå : 2D, 3D ½ºÄµÇìµå (Scan Head)  
·¹ÀÌÀú ºö Àü¼Û ½Ã½ºÅÛ : ±¤ÆÄÀ̹ö (Optical Fiber)  
     
   
      1.4 KW DDL Thomson knife
  ·¹ÀÌÀú °¡°ø ½Ã½ºÅÛ ¿î¿ë S/W : ¸¶Å·, ¿ëÁ¢, Á¶°¢   ¿­Ã³¸® ½Ã½ºÅÛ °ø±Þ °è¾à.
  ºöÇÁ·ÎÆÄÀÏ S/W (Laser Beam Profiler) : ÆÞ½º ºö ·¹ÀÌÀú (Pulsed), ¿¬¼Ó ºö ·¹ÀÌÀú (CW) 500W Direct Diode Laser
      System µµÀÔ.
      ½ºÇ® ¿­Ã³¸®¿ë 1.2KW DDL
  System °ø±Þ.

 

½´ÆÛÆÞ½º RF Co2 ·¹ÀÌÀú °ø±Þ.

  Small spot sizes                  OEM ·¹ÀÌÀú ¿ëÁ¢±â °ø±Þ °è¾à.
  Cold UV Marking 2ä³Î ´ÙÀÌ¿Àµå ·¹ÀÌÀú °³¹ß.
  Easy to use software ·¹ÀÌÀú ´ÙÀÌ¿Àµå µå¶óÀ̹ö
  Fast scanning speeds   (Laser Diode Driver with
  Proven Scanning Technology   integrated TEC) °³¹ß.
  Integrated UV Marking Solution 2.5KW IR Line Beam Generator
  Large work area with large depth of focus   °ø±Þ°è¾à
  <700 Watt single phase utility required UV ·¹ÀÌÀú ¸¶Å· ½Ã½ºÅÛ Ãâ½Ã
  Field proven model 3500 Series 355nm laser    
  Materials which can be marked, engraved, scribed, cut or drilled includes: wires,
    metals, sapphire, glass, diamond, polyamides, PCBs, coatings, ITO removal,  
   
silicon wafers, ceramics, plastics, fiber, paper, etc.      
 
       
                                                                               UV Laser Marking System