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Laser, Vision, Intelligence ±â¼úÀº ÀÚµ¿Â÷, ¹ÝµµÃ¼, µð½ºÇ÷¹ÀÌ, ÀÇÇÐ, ±âÃʰúÇÐ µî ¸ðµç »ê¾÷ºÐ¾ßÀÇ »ç¿ëµÉ ¼ö ÀÖ´Â ÀÚµ¿È ±â°èÀåºñ, ·¹ÀÌÀú °¡°øÀåºñ, ·¹ÀÌÀú ÀÇ·áÀåºñ, ºñÀü°Ë»ç °èÃøÀåºñ µî¿¡ ´Ù¾çÇÏ°Ô ÀÀ¿ëµÇ°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ, ¿ä¼Ò±â¼ú¿¡ °ü·ÃµÇ´Â Àåºñ/ºÎǰÀ» ÇÊ¿ä·Î ÇÏ´Â °í°´¿¡°Ô ¸¸Á·ÇÒ ¼ö ÀÖ´Â ÅëÇÕ ±â¼ú Á¦°ø ¹× »õ·Î¿î ÀÀ¿ë±â¼ú °³¹ßÀ» ÇÒ ¼ö ÀÖµµ·Ï ÃÖ¼±ÀÇ Çù·ÂÀ» ´ÙÇϰí ÀÖ½À´Ï´Ù. |
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·¹ÀÌÀú ´ÙÀÌ¿Àµå (Laser Diode), ·¹ÀÌÀú ´ÙÀÌ¿Àµå ¾î·¹ÀÌ (Laser Diode Array) |
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·¹ÀÌÀú ´ÙÀÌ¿Àµå ½ºÅØ(Laser Diode Stack), ·¹ÀÌÀú ÆßÇÁ ¸ðµâ (Laser Pump Module) |
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»ê¾÷¿ë, R&D¿ë, ÀÇ·á¿ë ·¹ÀÌÀú ½Ã½ºÅÛ |
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·¹ÀÌÀú ´ÙÀÌ¿Àµå µå¶óÀ̹ö (Laser Diode Driver) |
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»ê¾÷ÀÀ¿ëºÐ¾ß : ·¹ÀÌÀú ¸¶Å· (Laser Marking), ·¹ÀÌÀú ÄÆÆÃ (Laser Cutting) |
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·¹ÀÌÀú ¿ëÁ¢ (Laser Welding), ·¹ÀÌÀú ¿Ã³¸® (Laser Heat Treatment) |
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ÀÇ·á¿ë ÀÀ¿ëºÐ¾ß : ¿Ü°ú¼ö¼ú / Ä¡°ú¿ë·¹ÀÌÀú, ÇǺΰú (Skin Care) ·¹ÀÌÀú, |
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ºñ´¢±â°ú ·¹ÀÌÀú (Prostate Laser) |
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R&D¿ë ÀÀ¿ëºÐ¾ß : Ins OPO ·¹ÀÌÀú, Short Pulse ´ÙÀÌ¿Àµå ·¹ÀÌÀú, ·¹ÀÌÀú PIV ½Ã½ºÅÛ |
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(Laser Particle Image Velocity System) |
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EUV, VUV, UV, NIR Ä«¸Þ¶ó (Camera) |
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·¹ÀÌÀú ºö °èÃø¼¾¼ (Measurment Sensor) |
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·¹ÀÌÀú ºö ½ºÄµÇìµå : 2D, 3D ½ºÄµÇìµå (Scan Head) |
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·¹ÀÌÀú ºö Àü¼Û ½Ã½ºÅÛ : ±¤ÆÄÀ̹ö (Optical Fiber) |
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1.4 KW DDL Thomson knife |
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·¹ÀÌÀú °¡°ø ½Ã½ºÅÛ ¿î¿ë S/W : ¸¶Å·, ¿ëÁ¢, Á¶°¢ |
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¿Ã³¸® ½Ã½ºÅÛ °ø±Þ °è¾à. |
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ºöÇÁ·ÎÆÄÀÏ S/W (Laser Beam Profiler) : ÆÞ½º ºö ·¹ÀÌÀú (Pulsed), ¿¬¼Ó ºö ·¹ÀÌÀú (CW) |
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500W Direct Diode Laser |
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System µµÀÔ. |
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½ºÇ® ¿Ã³¸®¿ë 1.2KW DDL |
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System °ø±Þ. |
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½´ÆÛÆÞ½º RF Co2 ·¹ÀÌÀú °ø±Þ.
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Small spot sizes |
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OEM ·¹ÀÌÀú ¿ëÁ¢±â °ø±Þ °è¾à. |
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Cold UV Marking |
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2ä³Î ´ÙÀÌ¿Àµå ·¹ÀÌÀú °³¹ß. |
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Easy to use software |
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·¹ÀÌÀú ´ÙÀÌ¿Àµå µå¶óÀ̹ö |
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Fast scanning speeds |
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(Laser Diode Driver with |
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Proven Scanning Technology |
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integrated TEC) °³¹ß. |
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Integrated UV Marking Solution |
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2.5KW IR Line Beam Generator |
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Large work area with large depth of focus |
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°ø±Þ°è¾à |
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<700 Watt single phase utility required |
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UV ·¹ÀÌÀú ¸¶Å· ½Ã½ºÅÛ Ãâ½Ã |
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Field proven model 3500 Series 355nm laser |
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Materials which can be marked, engraved, scribed, cut or drilled includes: wires, |
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metals, sapphire, glass, diamond, polyamides, PCBs, coatings, ITO removal, |
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silicon wafers, ceramics, plastics, fiber, paper, etc. |
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UV Laser Marking System |
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